Description
Zinc Intersystem Bonding Bridge
Topaz�s zinc Bonding Bridge for intersystem bonding provides safe and reliable intersystem bonding b…150
Topaz�s zinc Bonding Bridge for intersystem bonding provides safe and reliable intersystem bonding between power and communication grounding systems. Meets the stringent requirements of 2008 NEC Article 250.49. Fabricated from tin plated zinc for optimal conductivity with stainless steel hardware and a weather resistant polycarbonate cover. Suitable for a wire size range of 6-2 awg; featuring a lay in lug for easy installation and inspection; cULus approved.
- Meets 2008 NEC article 250.94
- Stainless steel hardware
- Lay-in style lug for easy installations
- Mounts directly to grounding electrode conductor
- Robust one-piece extruded aluminum construction
- Zinc is tin plated for maximum conductivity
- Includes weather resistant polycarbonate snap on cover
- Available in zinc and bronze
- Meets 2008 NEC article 250.94
- Stainless steel hardware
- Lay-in style lug for easy installations
- Mounts directly to grounding electrode conductor
- Robust one-piece extruded aluminum construction
- Zinc is tin plated for maximum conductivity
- Includes weather resistant polycarbonate snap on cover
- Available in zinc and bronze
UPC | 751338175440 |
---|---|
UNSPSC | 39121311 |
Country of Origin | MUL |
Color: | Gray |
Material: | Copper |
Type: | Inter System Bonding Bridge |
Color: | Gray |
Label Description: | BONDING BRIDGE |
Material: | Copper |
Size (IN): | ZINC DIE CAST IN |
Standard: | Meets Requirements of 2008 NEC Article 250.49, cULus E170258 |
Type: | Inter System Bonding Bridge |
Wire Size: | 6 – 2 AWG |
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